The Schäfer Group participated simultaneously in two significant trade fairs on May 15 and 16, 2024. The first appearance took place at the regional trade fair “All About Automation” in Heilbronn, Germany, while the second was at the international “Electrical Wire Processing Technology Expo” in Milwaukee, USA.
At the regional trade fair “All About Automation,” the Schäfer Group presented current solutions for automated cable production. The main focus was on introducing innovative technologies that improve the efficiency and quality of cable production. Particular emphasis was placed on the automated solutions that encompass the entire production process from wire feeding to quality control of the cable.
The second appearance was at the international “Electrical Wire Processing Technology Expo” in Milwaukee, USA. Here, the Schäfer Group showcased numerous innovations in the field of wire and terminal processing. The new crimping applicators “SolidCrimp” and “AirCrimp,” which impressed with their precision and adjustability, were at the center of visitor interest. In addition, new solutions for quality control were presented, based on the current funding projects “OptiCrimp” and “DeepCrimpact”. Furthermore, the Schäfer Group presented the new crimping machines “BasicLine” and “ProLine,” which are characterized by high flexibility and user-friendliness.
Visitors had the opportunity to learn about the latest innovations and solutions from the Schäfer Group and to be convinced of their quality and performance.
