As part of the “Electrical Wire Processing Technology Expo” in Milwaukee, USA, the Schäfer Group presented numerous innovations in wire and terminal processing. The visitors were very interested in the crimping applicators “SolidCrimp” and “AirCrimp”, which impress with precision and adjustability. Additionally, solutions for quality control, such as the new crimp force monitoring CARAPIC, were presented. Furthermore, the Schäfer Group showcased various crimping machines, which are characterized by high flexibility and user-friendliness.
Visitors had the opportunity to learn about the latest innovations and solutions from the Schäfer Group and to be convinced of their quality and performance.