Various Innovations at our Booth
Exciting new developments characterized the Schäfer Group’s appearance at Productronica in Shanghai from March 25 to 27, 2026.
The focus of customer interest was on several innovations that were presented for the first time, such as the new Hotmelt Molding Machine MoldLine. The Crimp Force Monitoring CrimpWise with AI functions and the Software Platform Connect with Factory Monitoring for production analysis attracted great interest. Likewise, the Crimping Machine CrimpLine SELECT with selectable or subscribable press forces and the Crimping Machine CrimpLine ADJUSTABLE with programmable crimp height adjustment.
In addition, we continued to receive very good feedback on our latest Crimping Applicators. The offer from our branch in Gerstungen, which represented a bending and Stamping Tool as well as Parts Production with numerous sample parts, was also received very positively.
If you missed a visit to our booth, we would be happy to give you a detailed insight into our innovations at our company.