Low Pressure Molding Solutions

Systems for Low Pressure Molding

We offer innovative solutions for low pressure hotmelt molding. With this process, connectors, cable entries, and circuit boards can be protected.

To ensure connection systems can withstand extreme conditions such as heat, dust, or moisture, Schäfer offers cost-effective and efficient solutions with hotmelt molding technology. Using the low-pressure molding process, components are encapsulated and sealed at the wire or terminal.

We are pleased to advise you and assist in configuring your solution based on machine, tool, and material for your low pressure hotmelt solution.

Low Pressure Molding Polyamides

The Henkel brand TECHNOMELT is our first choice for industrial bonding with hotmelt adhesives and offers optimal results in manufacturing processes. TECHNOMELT adhesives enhance operational efficiency through their reliability and high quality.

The diverse materials, such as polypropylene, polyurethane, co-polyamide, co-polyester, Santoprene, TPE, Elastollan, and Hytrel, enable a wide range of application possibilities. They impress with rapid curing, strong adhesion, and high temperature resistance for demanding connections.

Molding Parts from our Production

We produce high-quality molding parts in small and medium-sized series with hotmelt as well as other molding materials. Our extensive expertise in processing these materials allows us to offer customized solutions for a variety of applications. Typical applications include:

• Injection molding of seals on components and assemblies.
• Encapsulation of cable connections such as crimp connections.
• Encapsulation of electrical components such as circuit boards and sensors.

Low Pressure Molding Machines

Hotmelt molding machines from Schäfer offer flexible applications and are ideal for encapsulating components of various designs. Thanks to their innovative design, they are optimal for processing various hotmelt adhesives and unfilled thermoplastics.