The new Henkel material is ideally suited for encapsulation electronic components using Schäfer molding equipment.
News
Discover our Innovations at the Kuteno 2026
We look forward to seeing you at our booth from June 9 to 11, 2026 in Bad Salzuflen, Germany.
Review to our Appearance at the Productronica China 2026
Exciting new developments and interesting conversations characterized the Schäfer Group’s presentations in Shanghai, China.
Reduced Prices for Crimping Applicators
Crimping applicator are now permanently more affordable! We pass on the benefits of our manufacturing process synergies to our customers.
New Crimp Force Monitoring System CrimpWise
Quality assurance at the highest level in the production of crimp connections in cable manufacturing.
Integration with U. Kolb Werkzeug Vertriebs GmbH
With the merger of the companies, Schäfer strengthens his market position and expands the portfolio.
Review to our Show Appearance at the Productronica 2025
Exciting new developments and interesting conversations characterized the Schäfer Group’s presentations in Munich, Germany.
Review of the “Electrical Wire Processing Technology Expo”
Numerous innovations in the field of automated production shaped our show appearance in Milwaukee, USA.
New Designations for Crimping Machines
With new product names, we have restructured our crimping machines and made them internationally understandable.
Review of the “All About Automation”
Innovative automation solutions for various industrial sectors characterized the trade fair appearance in Heilbronn, Germany.
